Heat-resistant BOPP films for high-speed processing

TPL is expanding its range of BOPP films with a series of heat-resistant grades designed for high-speed packaging applications.

Their dimensional stability under thermal stress, strength and transparency make them suitable for large pouches, hot-fill applications, bag-in-box systems and high-speed FFS machines. Double-sided treatment and controlled linear shrinkage minimise deformation, while optimised hot slip and coefficient of friction ensure consistent processing on high-speed packaging lines. Non-heat-sealable, these films are suitable for advanced multilayer laminates. The range includes the transparent CTF-K414 and CRF-K414 grades, as well as the matt DTF-K414 version. Both transparent grades are available in 12µm thickness to reduce material consumption. Their PP-based structure also enables the development of mono-material packaging compatible with mechanical recycling, where appropriate recycling streams are available.